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SSD 1TB INTEL M.2 660P SERIES, SSDPEKNW010T8X1

Availability:

1 in stock


AED 499.00

1 in stock

INTEL® SSD 660P SERIES

Intel 660p SSD

Finally, PCIe and Intel QLC 3D NAND in one SSD.

The first QLC-based client PCIe SSD in the industry, the 660p SSD continuing Intel’s leadership in flash cell technology and quality manufacturing. The QLC technology enables higher storage density and lower cost per GB. The PCIe 3.0 x4 host interface delivers bus bandwidth up to 32Gbps that eliminates the bottleneck of SATA interface, taking you everyday computing experience to a new level. Meet today’s storage needs and prepare for the growing demands of tomorrow with the Intel SSD 660p Series.ssd 660p series

Available in 512 GB, 1024 GB and 2048 GB to suit your needs.

Features and Benefits

Performance icon Capacity Icon Performance and price icon

PCIe* Performance at an Affordable Price

Empowered by Intel’s innovative Intel® QLC Technology, the Intel® SSD 660p offers higher capacities at a lower cost than TLC-based options.1 With PCIe*, the new SSD 660p skips SATA and its limitations to offer up to 2TB in one drive.

Twice the Capacity in Identical Footprints2

These client SSDs pack more data than TLC-based storage, allowing up to 2x more capacity in identical footprints. The thin M.2 80mm form factor makes it perfect for notebooks, desktops, and mobile devices that need storage for everyday computing.

Performance and Price That Matters

The SSD 660p hits the marks that matter for client SSDs. This drive is tuned to deliver a capacity optimized NVMe* performance and deliver an intelligent storage option for mainstream and entry-level computing.

Features At-a-Glance

Model Name Intel® Solid State Drive 660p Series
Capacity (GB) 512, 1024 (1TB), 2048 (2TB)
NAND Flash Memory 64-layer, QLC, Intel® 3D NAND Technology
Performance3 Sequential Read: Up to 1,800MB/s, Sequential Write: Up to 1800MB/s
Random 4KB Reads: Up to 250,000 IOPS, Random 4KB Writes: Up to 250,000 IOPS
Interface PCIe* 3.0×4, NVMe*
Form Factor, Height, Weight 80mm M.2 2280, S3, <10 grams
Power Consumption Active: 100mW, Idle: 40mW
Operating Temperature 0° C to 70° C

 

Specification

Essentials

Capacity 1.024 TB
Launch Date  Q3’18
Use Conditions  PC/Client/Tablet
Status Launched
Lithography Type
3D2 QLC

Performance

Sequential Read (up to)  1800 MB/s
Random Read (8GB Span) (up to) 150000 IOPS
Power – Active 0.1 W
Sequential Write (up to)  1800 MB/s
Random Write (8GB Span) (up to) 220000 IOPS
Power – Idle 0.040W

Reliability

Vibration – Operating 2.17 GRMS
Shock (Operating and Non-Operating) 1000 G
Endurance Rating (Lifetime Writes) 200 TBW
Uncorrectable Bit Error Rate (UBER) <1 sector per 10^15 bits read
Vibration – Non-Operating  3.13 GRMS
Operating Temperature Range 0°C to 70°C
Mean Time Between Failures (MTBF) >= 1.6 million hours
Warranty Period 1  Year Warranty

Package Specifications

Weight <10 grams
Interface  PCIe NVMe 3.0 x4
Form Factor M.2 22 x 80mm

Advanced Technologies

Enhanced Power Loss Data Protection No
High Endurance Technology (HET) No
End-to-End Data Protection  Yes
Intel® Remote Secure Erase No
Hardware Encryption  AES 256 bit
Temperature Monitoring and Logging No
Intel® Smart Response Technology Yes
Intel® Rapid Start Technology  Yes

 

           

           

           

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